Our Chapter Leaders

President:
Mei-Ming Khaw
Keysight Technologies (M) Sdn. Bhd.

Phone: 604-680-8603

Email Address:
mei-ming_khaw@keysight.com

Vice President:
Peng Wah Yeoh
Chiptronics (M) Sdn. Bhd.

Phone: 604-659-8888

Email Address:
pwyeoh@chiptronics.com.my

Secretary:
YS Chua
Kirsten Soldering-CH

Treasurer:
TC Loy
Kyzen Corp

View Committee Members

Chapter News

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Previous Chapter Events

Looking for current chapter news and events? Click here.

2016

Description Date Venue Remarks
South East Asia Technical Conference 2016 April 12-14, 2016 Eastin Hotel Contact admin@smtapenang.com.my with questions or comments.
Technical Talk June 24, 2016 Vitrox Corporation Berhad Contact David Vetharudge at dvetharudge@gmail.com with questions or comments.
SMTA Charity Event August 2, 2016 George Town, Penang Contact David Vetharudge at dvetharudge@gmail.com with questions or comments.
IPC Hand Soldering Competition September 22–23, 2016 Eastin Hotel Contact David Vetharudge at dvetharudge@gmail.com with questions or comments.
Vendor Show 2016 September 23, 2016 Eastin Hotel Contact David Vetharudge at dvetharudge@gmail.com with questions or comments.
AGM 2016 September 23, 2016 Eastin Hotel Contact David Vetharudge at dvetharudge@gmail.com with questions or comments.

2015

Description Date Venue Remarks
Product Intro & Charity Night January 23, 2015 Eastin Hotel Contact admin@smtapenang.com.my with questions or comments.
Smash That Badminton Tournament April 18, 2015 Penang Badminton Academy Contact David Vetharudge at dvetharudge@gmail.com with questions or comments.
South East Asia Technical Conference 2015 April 14-16 2015 Eastin Hotel Contact David Vetharudge at dvetharudge@gmail.com with questions or comments.
Vendor Show August 21, 2015 Eastin Hotel Contact David Vetharudge at dvetharudge@gmail.com with questions or comments.
Workshop: Tackling Poor Barrel Fill and Bridging in Wave Soldering November 12, 2015 Olive Tree Hotel Contact admin@smtapenang.com.my with questions or comments.

2014

Description Date Venue Remarks
Technical Talk & Social Meeting: How to take a good digital image? November 14, 2014 Kyzen Sdn Bhd Contact Andelyn Teo at admin@smtapenang.com.my with questions or comments.
South East Asia Technical Conference on Electronics Assembly Technologies April 8-10, 2014 Eastin Hotel Please contact
admin@smtapenang.com.my
with questions or comments.

2013

Description Date Venue Remarks
SMTA Vendor Show 2013 Nov 8, 2013 Eastin Hotel Registration for Technical Talk: Please email details (company, name, telephone, and email address) to admin@smtapenang.com.my.
Mixed Soldering Contest at SMTA Vendor Show 2013 Nov 8, 2013 Eastin Hotel Please contact Ms. Teo for further information. Email: admin@smtapenang.com.my Tel: 604.643.3817
SMTA Conference April 17-19, 2013 Eastin Hotel Contact David Vetharudge at dvetharudge@gmail.com, with questions or comments.
Bicycling Event     Contact David Vetharudge at dvetharudge@gmail.com, with questions or comments.

2012

Description Date Venue Remarks
SMTA Conference April 18-20, 2012 Eastin Hotel Contact David Vetharudge at dvetharudge@gmail.com, with questions or comments.
Badminton Tournament May 26, 2012   Contact David Vetharudge at dvetharudge@gmail.com, with questions or comments.
Vendor Day November 16, 2012   Contact David Vetharudge at dvetharudge@gmail.com, with questions or comments.

2011

Description Date Venue Remarks
Technical Talk February 24, 2011 Suntech Bayan Baru Contact David Vetharudge at dvetharudge@gmail.com, with questions or comments.
SMTA Conference May 19 & 20, 2011 Eastin Hotel Contact David Vetharudge at dvetharudge@gmail.com, with questions or comments.
Networking Bowling Game June 2011 Sunshine Square Bowling Contact David Vetharudge at dvetharudge@gmail.com, with questions or comments.
Technical Talk August 2011 Suntec Bayan Baru Contact David Vetharudge at dvetharudge@gmail.com, with questions or comments.
Exhibition Table Top October 28, 2011 Eastin Hotel Contact David Vetharudge at dvetharudge@gmail.com, with questions or comments.

2010

Description Date Venue Remarks
Free Technical Talk for SMTA Members March
12th, 2010
Suntech Contact David Vetharudge at dvetharudge@gmail.com, with questions or comments.
Free Seminar, AGM and Dinner for SMTA Members May
14th, 2010
Suntech Contact David Vetharudge at dvetharudge@gmail.com, with questions or comments.
SMT Engineer Certification April/May
2010
Celestica Kulim Contact David Vetharudge at dvetharudge@gmail.com, with questions or comments.
Friendly Badminton Match for SMTA Members August
14th, 2010
Bukit Dumbar Badminton Court Contact David Vetharudge at dvetharudge@gmail.com, with questions or comments.
Exhibition (Table Top) November
19th, 2010
Eastin Hotel Contact David Vetharudge at dvetharudge@gmail.com, with questions or comments.
Conference November
19th & 20th, 2010
Eastin Hotel Contact David Vetharudge at dvetharudge@gmail.com, with questions or comments.

SMTA Penang Exhibition 2016

IPC Hand Soldering Competition

Venue: Eastin Hotel Penang
Date: September 22–23, 2016

IPC Hand Soldering Competition
IP Hand Soldering Competition
IPC Hand Soldering Competition
September 22–23, 2016 • Eastin Hotel Penang

Who’s the Best of the Best
in Hand Soldering?

Do you or someone you know have what it takes to win at hand soldering?
The time to shine is at the IPC Hand Soldering Competition in conjunction with SMTA Penang Exhibition 2016.

The reliability of electronic equipment is ensured by zero-defect soldering processes. This contest recognizes the best skills in hand soldering complex printed board assemblies.

Who's the best of the best in Malaysia? If you think you have what it takes to be a champion of hand soldering, then bring your skills to the IPC hand soldering championship at SMTA Penang Exhibition 2016!

Over two days, participants will compete against each other to build a functional electronics assembly within a half-hour time limit. Assemblies will be judged on soldering in accordance with IPC-A-610F Class 3 criteria, the speed at which the assembly was produced and overall electrical functionality of the assembly. IPC-A-610 Master Instructors will serve as the judges.

Prizes:
Cash awards will be given to the winner and two runners-up. The winner will also get the chance to compete at the IPC World Championship at HKPCA International Printed Circuit & IPC APEX South China Fair in Shenzhen, China.

The number of participants is limited, so participation is on a first come, first served basis.
Submit your entry today at www.ipc.org/hsc-malaysia.

Register Now
Gold Sponsors Supported by
Kyzen Nihon Superior
 
IPC Nepcon Malaysia 2015

Charity Event

SMTA Charity Event

Venue: 6, Halaman Ariffin (Off Jalan Burmah), 10400 George Town, Penang
Date: August 2, 2016
Time: 5:30pm to 6:30pm

SMTA members will have the opportunity to distribute 90 packets of pre-packed vegetarian food and drinking water at the Kechara Soup Kitchen Center.

Diners will queue up to provide their Soup Kitchen registration card before they are entitled to their food.

Please register to be a volunteer by contacting us by email.

Workshop: Tackling Poor Barrel Fill and Bridging in Wave Soldering

Technical Workshop

Technical Talk

Venue: Vitrox Corporation Berhad
Date: June 24, 2016
Time: 1:30pm to 4:30pm

DOWNLOAD THE REGISTRATION FORM

Workshop: Tackling Poor Barrel Fill and Bridging in Wave Soldering

South East Asia Technical Conference 2016

South East Asia Technical Conference on Electronics Assembly 2016

Venue: Eastin Hotel
Date: April 12-14, 2016

DOWNLOAD THE PROGRAM SCHEDULE

Half-Day Training Workshops

  • WS1
    - Designing the Cleaning Process within the PCB Assembly Operations Mike Bixenman, DBA., KYZEN Corporation
  • WS2
    - Industry 4.0 Smart Factory and Design Collaboration with Manufacturing Jay Gorajia, Mentor Graphics Corporation
  • WS3
    - Solder Paste Evaluation (A review of How Solder Pastes are Evaluated) Neil Poole, Henkel Electronic Materials LLC
  • WS4
    - Designing in Reliability by Assessing Contamination at the Component Interface Mike Bixenman, DBA., KYZEN Corporation
  • WS5
    - It’s Time for Low Temperature-Low Temperatures Solders, New Development and Their Applications Ning-Cheng Lee, Ph.D., Indium Corporation
  • WS6
    - An Overview of the Factors and Mechanisms Impacting Reliability in HALT Neil Poole, Henkel Electronic Materials LLC

Keynote Presentations

  • LEDS: The Future is Bright - Trends &
    Challenges in Manufacturing
    Mohammed Khan, M.S., Lumileds
  • Nanotechnology in Electronics Packaging,
    Interconnect, and Assembly
    Chuck Bauer, Ph.D., TechLead Corporation

Program Sessions

  • Solder Alloy for Reliability
  • LED Technology
  • Traceability and Test
  • High Reliability
  • Components and Microelectronics
  • Printing and Assembly
  • BGA and BTC
  • Harsh Environments
Workshop: Tackling Poor Barrel Fill and Bridging in Wave Soldering

Technical Workshop

Tackling Poor Barrel Fill and Bridging in Wave Soldering

Date: November 12, 2015

Olive Tree Hotel, Penang

Please contact
Contact admin@smtapenang.com.my with questions or comments.

Download the Registration Form

Wave Soldering is still being used in board assembly lines despite most of the interconnections have shifted to Surface Mount Technology. With the introduction of lead-free requirement, the wave soldering process faces even more challenges. Engineers are baffled with increase incidences of insufficient barrel fill and bridging defects. To circumvent these problems, the technical root causes need to be understood. Hence, the class will provide a platform to discuss and address these problems.

That is why we are inviting you to attend this workshop, which will be held on November 12, 2015 at Olive Tree Hotel, Penang. Please indicate your interest by completing the Registration Form. We look forward to your participation and support.

Course Outline

  • Introduction
    - What is insufficient barrel fill/hole-fill and bridging?
  • Solderability
    - Wetting mechanism in soldering, surface tension and capillary forces.
  • Wettability
    - Component terminals and plated through hole wettability.
    - Fluxes functions during soldering.
  • A quick review on Wave soldering major parameters
    - Fluxing, Preheating and Wave contact.
  • Major peeling forces involved at the wave soldering exit.
  • Thermal Demand affecting Barrel fill
    - Heat dissipation and conductivity.
  • Geometry
    - Parameter to consider when using wave selective pallet.
    - PCB Land pattern and its thermal relief.
    - Land pattern for bridging reduction
  • Board lamination/surface finishes issues pertaining to barrel fill.
  • Strategies for overcoming poor barrel fill and bridging.
  • Equipment maintenance for Consistency on barrel fill and bridging reduction.
Workshop: Tackling Poor Barrel Fill and Bridging in Wave Soldering

SMTA Vendor Show

Be charged with the potential to power your business.

In the electronics manufacturing industry, success is built upon a culture that understands and embraces the product realisation solution model.

Aptly themed ENHANCING ELECTRONICS MANUFACTURING THROUGH INNOVATION, the SMTA Vendor Show is an ideal opportunity to meet and interact with people in the region and tactically deploy revenue-churning machineries to compete effectively in 2015/2016.

That is why we are inviting you to support the 7th SMTA Vendor Show, which will be held on Friday, August 21, 2015 at Eastin Hotel Penang. Please indicate your interest by completing the Exhibitor Registration Form. We look forward to your participation and support.

EXHIBITOR BOOTH AWARD OF EXCELLENCE Winner receives RM500 off next year's booth fee!

Friday, August 21, 2015
9:00 am - 5:00 pm
Eastin Hotel Penang

DOWNLOAD THE VENDOR FORM

Vendor Show

South East Asia Technical Conference 2015

South East Asia Technical Conference on Electronics Assembly Technologies

Date: April 14-16, 2015

Eastin Hotel

1 Solok Bayan Indah, Queens Bay,
11900 Bayan Lepas, Penang, Malaysia
Phone: +604-612-1111

Please contact
Contact David Vetharudge at dvetharudge@gmail.com with questions or comments.

Download the Program Schedule

Tuesday, April 14th - Workshops

8:30 am - 12:00 pm
WS1: DfM for Advanced Soldering Technology
Ning-Cheng Lee, Ph.D., Indium Corporation

8:30 am - 12:00 pm
WS2: The Latest & Hottest SMT Trends: What You Need To Know Today To Survive Tomorrow
Mukul Luthra, Waterfall Technologies

1:30 pm - 5:00 pm
WS3: DfR for Advanced Soldering Technology
Ning-Cheng Lee, Ph.D., Indium Corporation

1:30 pm - 5:00 pm
WS4: Advanced SMT: Process Development And Yield Enhancement Involving Advanced Packages, 3-D Applications, Pip and Pop Assembly
Mukul Luthra, Waterfall Technologies

Wednesday, April 15th - Technical Program Day 1

8:00 am
Registration

8:50 am
Opening Comments

9:00 am
Keynote Address
Scott Mokler, Intel Corporation

Refreshment Break — 10:00 am - 10:30 am

Session 1: Manufacturing for Reliability

10:30 am
Chemical Influences on the Reliability of Complex Assemblies
Bruno Tolla, Kester

11:00 am
Fine pitch Package on Package (PoP) Process Characterization and Readiness
Ricky Liew, Motorola Solutions

11:30 am
The Development of a 0.3mm Pitch CSP Assembly Process, Part 1: Stencil Printing Considerations
Mark Whitmore, DEK Printing Solutions

12:00 pm
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part I
Wei Hang Teh, Inventec Performance Chemicals

Lunch — 12:30 pm - 2:00 pm

Session 2: Alternate Solder Alloys & Failure Analysis Techniques

2:00 pm
SMT Soldering with Low Temperature Solder Paste
Kok Kwan Tang, Intel

2:30 pm
Package-on-Package(PoP) Solder Short FA Technique
Afaq Ahmed, Celestica Malaysia Sdn Bhd

Refreshment Break — 3:00 pm - 3:30 pm

Session 3: Cleaning & Conformal Coating Part 1

3:30 pm
A Novel Solution for Circuit Board Protection
Kevin Tan, Henkel

4:00 pm
Maintaining OSP Coating Integrity During the Cleaning Process
Doris Lam, ZESTRON Precision Cleaning Sdn Bhd

4:30 pm
Real Time Electronic Cleaning Agent Control
Mike Bixenman, DBA, Kyzen Corporation

5:00 pm
Qualification of Saponified Wash on Ultra Switch PCA
Moon Kin Lee, Keysight Technologies

Thursday, April 16th - Technical Program Day 2

8:00 am
Registration

Session 4: Cleaning & Conformal Coating Part 2

9:00 am
Innovative Nanocoatings for High Volume Conformal Coating of Electronics
Filip Legein, Europlasma

9:30 am
Effects Of Flux Residues on Thermal Shock Performance of Conformal Coatings
Phil Kinner, Electrolube

10:00 am
Electronic Cleaning Fluid Advancements
Mike Bixenman, DBA, Kyzen Corporation

Refreshment Break — 10:30 am - 11:00 am

Session 5: Advanced Packaging Part 1

11:00 am
Low Porosity Pressure Less Sintering of Novel Nano- Ag Paste for Die Attach
Ning-Cheng Lee, Ph.D., Indium Corporation

11:30 am
COOL Substrate for 2.5D Packaging Technology
Charles Lin, Ph.D., Bridge Semiconductor Corporation

Lunch — 12:00 pm - 1:30 pm

Session 6: Emerging Manufacturing Technologies

1:30 pm
Multi-Array PCB Traceability System
Christoph Wimmer, Microscan

2:00 pm
Laser Singulation. Is It A Realistic Alternative To Routers?
Allen Duck, Getech Automation

2:30 pm
Addressing High Precision Automated Optical Inspection Challenges with Unique 3D Technology Solution
Mallika Ramakrishna, CyberOptics Corporation

3:00 pm
Key to Building Solar Panel Efficiently and Effectively
John P. Almirañez, Universal

Refreshment Break — 3:30 pm - 4:00 pm

Session 7: Advanced Packaging Part 2

4:00 pm
Enabling the Use of PET Flexible Substrates for Solid State (LED) Lighting Applications
Ken Lau, Alpha

4:30 pm
Guidelines for Printed Circuit Board Assembly (PCBA) of UTAC Group’s Grid Array Package (GQFN) and its Board Level Reliability
Kyaw Ko Lwin, United Test and Assembly Center Ltd

5:00 pm
Ultralow Residue (ULR) Semiconductor Grade Fluxes for Copper Pillar Flip-Chip
Sze Pei Lim, Indium Corporation

5:30 pm
End of Technical Program

Smash That Tournament

As part of its 8th anniversary celebration, SMTA Penang Chapter is bringing you an exciting championship. So pick up your rackets and show your passion for this sport. Give the sportsman inside you a chance to shine. Show off your skills and bag the trophy.

Entry fee is RM 20.00 for members and RM 40.00 for non-members. Please contact Ms Teo at +60 4 643 3817 or email admin@smtapenang.com.my

Saturday, April 18, 2015
9:00 am - 1:00 pm
Penang Badminton Academy (Beside Oasis Condominium)

DOWNLOAD THE ENTRY FORM

To register, fill-out the entry form and return to admin@smtapenang.com.my.

Smash This Tournament

Product Intro & Charity Night

As part of its 8th anniversary celebration, SMTA Penang Chapter is organizing a Product Intro & Charity Night dinner in aid of needy orphans. We endeavor to provide these children the basic necessities of life by goodwill donations from volunteers.

We cordially invite you to attend as our honored guests in this charitable night. Your contribution can make a big change to a total or partial orphan's life.

Friday, January 23, 2015
6:00 pm - 10:00 pm
Eastin Hotel Penang (Ballroom – Level 3)

Kindly fill-out the attached form and return to admin@techment.com.my.

Event: Product Intro & Charity Night View Event Flyer & Form

Pictures from the Event

Click on an image to view a larger version.

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Technical Talk & Social Meeting

South East Asia Technical Conference 2014

South East Asia Technical Conference on Electronics Assembly Technologies

Date: April 8-10, 2014

Eastin Hotel

1 Solok Bayan Indah, Queens Bay,
11900 Bayan Lepas, Penang, Malaysia
Phone: +604-612-1111

Please contact
admin@smtapenang.com.my or patti@smta.org with questions or comments.

South East Asia Technical Conference on Electronics Assembly is a highly technical three-day event that is focused on today's most important and timely issues.

The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.

Sessions and topics in our 2014 program will focus on new processes and materials, reliability, cleaning challenges, harsh environment applications, advanced packaging to include package on package, process control and the latest developments in surface finishes.


Why Should You Attend:

  • There will be adequate time to have our industry experts respond to your questions
  • Networking time will allow you to continue discussions following the presentations
  • This is one of the best ways to enhance your knowledge and your company's profitability
  • Extensive participation from experts from around the world provides for a comprehensive educational experience
  • The SMTA reputation ensures high quality technical information that can be put to use immediately

Technical Program - Tuesday, April 8th

9:00 am - 12:00 pm
T1 - Electromigration - The Hurdle for Miniaturization and High Power Devices
Ning-Cheng Lee, Ph.D., Indium Corporation

9:00 am - 12:00 pm
T2 - 3D PoP for the SMT World
Charles Bauer, Ph.D., TechLead Corporation

1:30 pm - 4:30 pm
T3 - Achieving High Reliability of Lead-Free Soldering - Materials Consideration
Ning-Cheng Lee, Ph.D., Indium Corporation

1:30 pm - 4:30 pm
T4 - Cleaning and Contamination Process Guide
Mike Bixenman, Ph.D., Kyzen Corporation

View more information about these training workshops.

Conference Day 1 - Wednesday, April 9th

Session 1: Sustainable Lead Free Manufacturing
Chair: David Vetharudge, Listech Technology

9:00 am
Applying Lean Six Sigma in Manufacturing (Printed Circuit Board Assembly)
Celine YC Chong, IBM Corporation

9:30 am
Do's and Don'ts - Good and Bad Practices - Myths and Reality of Soldering, Rework and Repair
Terry Clitheroe, SMCBA (Australian SMT Association)

10:00 am
0.35mm Pitch Extra Small Outline No Lead (XSON) Package PCBA Process Characterization (On Main Board)
Ricky Liew, Motorola Solutions Sdn Bhd

Coffee Break — 10:30 am - 10:45 am

Session 2: Solder Paste Reliability
Chair: KL Lim, Plexus Corporation

10:45 am
The Rheology and Printing Behavior of Water Soluble Solder Pastes
Li Tianpeng, Kester Components Pte Ltd

11:15 am
Reliability of BGA Assemblies with SAC and 57Bi42Sn1Ag Alloys
Sehar Samiappan, Indium Corporation

11:45 am
High Reliability Pb-Free Halogen Free Solder
Kevin Tan, Henkel Ltd

Lunch — 12:15 pm - 1:15 pm

Session 3: Reliability of Low Silver Alternatives to SAC Alloys
Chair: Chee Choong Kooi, Intel Corporation

1:15 pm
The Second Generation Shock Resistant and Thermally Reliable Low Ag SAC Solder Doped With Mn
Sehar Samiappan, Indium Corporation

1:45 pm
Impact of Low Ag SAC Solder Pastes on BGA Solder Joint Quality
Kok Kwan Tang, Intel Corporation

2:15 pm
Gold Embrittlement in Lead-free Solder
Alex Chiu, Agilent Technologies

2:45 pm
Structure and properties of Magnetic Receptive Fe_Centric SAC305 Solder
R. Gopal Krishnan, National University of Singapore

Coffee Break — 3:15 pm - 3:30 pm

Session 4: Emerging Technologies
Chair: Jonas Sjoberg, Flextronics

3:30 pm
Inspection Strategies for More Accurate, Faster and Smarter Inspection
Mallika Ramakrishna, CyberOptics Corporation

4:00 pm
The Use of Micro/ATR FTIR in PCBA CRD Smearing Failure Analysis
Kong Hui Lee, Cisco Systems (Malaysia) Sdn. Bhd.

4:30 pm
Package on Package (POP) Process Characterization and Capability Study
Kenny Chiong, Motorola Solutions

5:00 pm
Encapsulant Materials Designed for Increasing Reliability and Protection of Electronic Devices
Brian Toleno, Henkel Electronic Materials

Conference Day 2 — Thursday, April 10th

Session 5: Cleaning
Chair: AK Tan, Jabil Circuit Sdn. Bhd.

9:00 am
Concentration Monitoring & Closed Loop Control – A Technological Advancement
Yeoh GT, ZESTRON

9:30 am
Cleaning PCBs in Electronics: Understanding Today's Needs
Teh Wei Hang, Inventec Performance Chemicals

10:00 am
Cleaning Soldering Residues from High Temperature Alloys
Mike Bixenman, Kyzen Corporation

Coffee Break — 10:30 am - 10:45 am

Session 6: Miniaturization
Chair: Jensen Lee, Round Roots

10:45 am
Ultra Miniaturized 01005 Passives Assembly
Ng Chin Fei, Motorola Solutions

11:15 am
Lead-Free and Halogen Free Solder Flip Chips On Board Using SMT Processes and Materials For Miniaturization and Lower Cost
Jonas Sjoberg, Flextronics

11:45 am
Failure Modes and Failure Analysis of LEDs in ICMs and Process and Design Optimization for LEDs Within ICMs
Ang Ai Kiar, IBM Corporation

Lunch — 12:15 pm - 1:15 pm

Session 7: QFN Reliability
Chair: Tay Cheng Siew, Intel Product (M) Sdn. Bhd.

1:15 pm
Reliability Improvement of Array QFN Package
You Chye How, Texas Instrument

1:45 pm
Optimizing Solder Voids Performance at Thermal Pad and Printability of its Peripheral Pads for Dual Row QFN Assembly
Ooi Hock Wooi, Motorola Solutions (M) Sdn Bhd

2:15 pm
Bottom Termination Component Design Considerations to Improve Cleaning
Mike Bixenman, Kyzen Corporation

2:45 pm
A Process for Improved QFN Reliability and Inspectability
Lenora Toscano, MacDermid

Coffee Break — 3:15 pm - 3:30 pm

Session 8: Latest Advances in High Density Interconnect
Chair: Khaw Mei Ming, Agilent Technologies

3:30 pm
TSV Barriers Create SMT Opportunities
Charles Bauer, Ph.D., TechLead Corporation

4:00 pm
High Density Assembly in PCB Cavities
Jonas Sjoberg, Flextronics

4:30 pm
Failure Analysis of High Density Printed Circuit Board Assembly Inside Smartphone
Anil Kurella, Ph.D., Intel Corporation

SMTA Vendor Show 2013

SMTA Vendor Show 2013

Date: Nov 8, 2013

Time: 9:00AM - 5:00PM

Eastin Hotel

Penang, Malaysia

Registration for Technical Talk: Please email details (company, name, telephone, and email address) to admin@smtapenang.com.my.

It is a great pleasure to invite you to the SMTA tabletop exhibition and Free Technical Talk.

The most happening, exciting talked about electronics assembly event, SMTA Vendor Show 2013, returns to the Eastin Hotel, Penang on 8th Nov, 2013. Showcasing an assortment of products and services that range from raw materials to backend equipment, SMTA Vendor Show has everything you need to keep up with rapidly changing technology, identify innovative solutions, and maintaining your competitive edge.

Attendees get valuable technical information and meet leading suppliers. Exhibitors get a great opportunity to connect with people in their region who want to know about their products and services.

Don't miss out on the opportunity to view an assortment of products from top names including:

  • Chiptronics
  • Listech
  • Agilent
  • Henkel
  • Zestron
  • Ultracore
  • ATS
  • Photo Stencil
  • New Long Shine
  • Crest Systems
  • and many more!
  • Kyzen
  • DNIV
  • Finetech
  • Nihon
  • Dou Yee
  • DEK
  • Universal
  • Premtronics
  • Transtec
  • Practical Components

You will also get to attend a FREE technical seminar that relates to surface mount technology and future electronics assembly.

Mixed Soldering Contest at SMTA Vendor Show 2013

Mixed Soldering Contest at SMTA Vendor Show 2013

Date: Nov 8, 2013

Time: 9:00AM - 4:00PM

Eastin Hotel

Penang, Malaysia

Please contact Ms. Teo for further information. Email: admin@smtapenang.com.my Tel: 604.643.3817

*Registration will be on a First Come First Serve basis.*

Leveraging Technology & Best Practices For Greater Engineering Excellence.

As board spacing gets tighter and circuit board density soars, it takes a steady hand and keen eye to do manual soldering. Those who perform manual soldering to build prototypes and perform rework will now have a chance to show their skills and compete for the ultimate title of Mixed Soldering Champion at SMTA Penang Vendor Show.

Contest rules and regulations in brief:

  1. Only pre-registrations are eligible to participate.
  2. Maximum of 10 teams
  3. Each team to have maximum of 2 participants
  4. Each team will be allocated 30 minutes to solder a set of components onto a PCB. All components and PCB will be provided by the organizer.
  5. Organizers have the final say of the team schedule and will only disclose the schedule on the day of the competition.
  6. Tools will be provided, participants can select from provided tools. Participants own tools are not allowed.
  7. Every successful participant MUST attend a 5 minute briefing prior to the contest.
  8. The closing date for applications is 1st November, 2013.
  9. Assemblies will be judged on soldering method and solder joint quality in accordance with IPC-A-610E Class 2 criteria, as well as the speed at which the assembly was produced. IPC-A-610 Master instructors will serve as judges. The judges' decision will be final, no complaints will be entertained.
1st Prize with Trophy - RM500
2nd Prize with Trophy - RM300
3rd Prize with Trophy - RM100

Registration for the Mixed Soldering Contest has ended.

SMTA Conference 2013

South East Asia Technical Conference on Electronics Assembly Technologies

Date: April 17-19, 2013

Eastin Hotel

Penang, Malaysia

Contact David Vetharudge at dvetharudge@gmail.com with questions or comments.

Click here to view pictures from the event

The South East Asia Technical Conference on Electronics Assembly is a highly technical three-day event that is focused on today's most important and timely issues.

Sessions over the two days will cover:

  • Supply Chain
  • Solder Printing
  • Alternative Alloys
  • BTC Assembly & Repair
  • Counterfeit Components
  • Cleaning
  • New Material Reliability
  • Advanced Packaging

Why Should You Attend:

  • There will be adequate time to have our industry experts respond to your questions.
  • Networking time will allow you to continue discussions following the presentations.
  • This is one of the best ways to enhance your knowledge and your company's profitability.
  • Extensive participation from experts from around the world provides for a comprehensive educational experience.
  • The SMTA reputation ensures high quality technical information that can be put to use immediately.

Registration:

Your Conference (Two Day) registration fee will include a CD Conference Proceedings, coffee breaks, and lunches. Conference fees are "SBL Claimable."

Register Now or complete a hard-copy registration form.

Members: log on to receive the discounted rate!

Group Discounts:

Register four people for the Technical Conference and pay for only three! The four people must be from the same company, and registrations must be submitted consecutively. The discount will be processed at SMTA headquarters, and is not available on-site. Complete a hard copy registration form for each person signing up for a group discount.

To pay with cash or check, contact SMTA Penang Chapter at admin@smtapenang.com.my.

Educational Training Half-Day Courses on 17th April, 2013

WS2: 9:00am – 12:00pm

Package on Package Technology – What It Is, What Works, What Doesn't Work
Yan Liu, Indium Corporation

WS3: 1:30pm – 4:30pm

Material Properties and How They Affect Electronic Devices
Brian Toleno, Henkel Corporation

WS4: 1:30pm – 4:30pm

Embedded SMT Assembly: Components, Devices & Systems
Chuck Bauer, TechLead Corporation

 

** Registrations are being taken through the SMTA Online Registration System.

**Please email Patti at patti@smta.org for any clarification.

Pictures from the Event

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Bicycling Event

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SMTA Conference

South East Asia Technical Conference on Electronics Assembly Technologies

Date: April 18-20, 2012

Eastin Hotel

Penang, Malaysia

Contact David Vetharudge at dvetharudge@gmail.com with questions or comments.

Click here to view pictures from the event

The South East Asia Technical Conference on Electronics Assembly is a highly technical three-day event that is focused on today's most important and timely issues.

The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.

Sessions and topics in our 2012 program will focus on new processes and materials, reliability, cleaning challenges, harsh environment applications, advanced packaging to include package on package, process control and the latest developments in surface finishes.

Special recognition is given to the Technical Committee for their many contributions in developing this outstanding program.

Technical Committee

LyGuat Lee, Ph.D, Flextronics, Conference Chair
KL Lim, Plexus
Lian-Huat Ng, Plexus Corp.
Teng Hoon Ng, Celestica, Inc.
Jona Sjoberg, Flextronics
AK Tan, Robert Bosch Sdn Bhd
David Vetharudge, Listech Technology

 

Session Topics

  • Business and Supply Chain
  • Components and Advanced Packaging
  • Harsh Environments
  • Soldering Challenges - Including Head in Pillow
  • Soldering Processes and Materials
  • Soldering - Through Hole Processes
  • Substrates and Printed Circuit Boards

View the full conference schedule

 

Accommodations

Eastin Hotel Penang
1 Solok Bayan Indah
Queens Bay, 11900 Bayan Lepas, Pulau Pinang, Malaysia
Tel: +604-6121111

Book your hotel reservations online: http://www.eastinhotel-penang.com/ppc/?gclid=CPCu7tj69qYCFcjsKgod3gEhDg

 

Registration

Your Conference (Two Day) registration fee will include a CD Conference Proceedings, coffee breaks, and lunches.

Conference Registration Options Members Non-members
Two-Day Conference (Thursday/Friday, 19-20) RM455
US 150
RM607
US 200
One Day (Thursday 19) Conference RM303
US 100
RM379
US 125
One Day (Friday 20) Conference RM303
US 100
RM379
US 125
Speaker-Two-Day Conference (only select this if you are presenting at the event) RM303
US 100
RM303
US 100

 

Training Workshops (Note: Training workshops are not included with two-day conference registration)

Training Workshops Registration:

Workshop Registration Options Members Non-members
WS1: Reliability of Lead-Free Solder Joints (Wed 18th- 9:00am - 12:00pm) RM303
US 100
RM607
US 200
WS2: Designing for Reliability ~ Cleaning Basics in the Age of High Density Interconnects (Wed 18th- 9:00am - 12:00pm) RM303
US 100
RM607
US 200
WS3: Electromigration – The Hurdle For Miniaturization and High Power Devices (Wed 18th- 1:30pm - 4:30pm) RM303
US 100
RM607
US 200

 

WS1: 9:00am – 12:00pm
Reliability of Lead-Free Solder Joints
Instructor: Ning-Cheng Lee, Ph.D., Indium Corporation

What You Can Learn From This Course:
This course covers the reliability of lead-free solder joints. The reliability discussed includes the failure modes, thermal cycling reliability, and fragility of solder joints as a function of material combination, thermal history, and stress history, and novel alloys with reduced fragility will be presented. Corrosion, and tin whisker will also be discussed. The emphasis of this course is placed on the understanding of how the various factors contributing to the reliability.

Course Content:
A. Thermal Cycle Reliability of Lead-free Solder Joints
1). Effect of Thermal Cycle Test Condition
2). Effect of PCB Surface Finish Cu vs Ni
3). Effect of Reflow Temperature
4). Reliability of Reworked SMT Joints
B. Fragility
1). Fragility of Lead-Free Solder Joints
2). Effect of Component Finish
3). Effect of Alloy, PCB Surface Finish, Reflow History, and Strain Rate
4). Effect of IMC Thickness
5). Effect of Isothermal Aging
6). Effect of Thermal Cycling
7). Effect of Intermetallic Morphology
8). Novel Alloys with Reduced Fragility
a. Mn, Ti, (Bi, Ce, Y) Dopants on SnAgCu
b. SnAgNiP, SnAgCuP
c. Ni, In Dopants on Sn1.0Ag0.1Cu
d. Co, Pt, Ni Dopants on SnAg
C. Reliability – Corrosion
1). SAC405
2). Corrosion Resistance of PWB Finishes
D. Tin Whisker

Who Should Take This Course:
Any one who wants to know the reliability lead-free solder joints under various applications and like to know the best options should take this course.

Abut The Instructor:
Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 20 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973.

WS2: 9:00am – 12:00pm
Workshop Title: Designing for Reliability - Cleaning Basics in the Age of High Density Interconnects
Instructors: Mike Bixenman and Jason Chan, Kyzen Corporation

Workshop Overview
As highly dense circuit assemblies continue to advance at a rapid pace, the removal of process residues is ever more necessary. Low residue no-clean flux residues did not require cleaning on assemblies with larger spacing between conductors. As the distance between conductors narrow, residues under component gaps pose a greater reliability risk. Additionally, the transition to lead-free alloys with tighter component densities requires flux residue innovations that can withstand higher reflow temperatures. Traditional cleaning agents and cleaning equipment may not be able to remove these harder to clean flux residues from extremely small geometries.

Increased circuit functionality is accomplished using bottom termination surface mount components. As components reduce in size, the distance from the board to the underside of the component reduces. Flux residues bridge conductors making cleaning highly difficult. One of the most challenging issues is the selection of an appropriate cleaning process that will clean flux residues under these extremely tight geometries.

Designing for reliability requires repeatability and reproducibility studies during engineering and manufacturing development from pass test to good design. Full operational testing is needed to prove that electronic assemblies and packages operate as specified. Discovering failures after products are designed causes scheduled delays and increases in life-cycle cost. The cleaning workshop will teach about contamination and its effect on reliability, cleaning in an HDI world, designing the cleaning process, integrating the cleaning agent and machine, and controlling the process.

Topics People Will Learn from Attending the Workshop:

  • Electronic Assembly Failure Mechanisms
  • Cleaning in an HDI World
  • Designing the Cleaning Process
  • Integrating Cleaning Agent and Cleaning Machine
  • Controlling the Process

Who Should Attend the Cleaning Workshop?

  • Circuit Assembly Designers
  • Process Engineers
  • Quality Control Engineers
  • Environmental Engineers

WS 3: 1:30 pm – 4:30pm
Electromigration – The Hurdle For Miniaturization and High Power Devices
Instructor: Ning-Cheng Lee, Ph.D., Indium Corporation

What You Can Learn From This Course:
Electromigration is migration of metal materials driven by the high current density. With the continuous miniaturization and increasing versatility and speed of electronic devices, the current density of miniaturized solder joints is getting so high that the solder joint integrity deteriorates rapidly due to electromigration. This is particularly true for high power devices. This course covers all critical aspects of electromigration of solder joints, including failure mechanism, effect of solder alloy composition, solder joint metallurgy and configuration , pad design, pad composition, current density, temperature, and current polarity. Electromigration behavior within redistribution layer is also reviewed and discussed. Most importantly, recommendation will be provided about how to achieve long life under high current-stressed conditions for solder joints and redistribution layer through optimized designs.

Course Content:

  • EM mechanisms
    Effect of current density and temperature
    EM path through solder, Al, and Cu
    Effect of solder grain orientation
    Effect of solder composition
  • EM resistance of solder joints
    Sn vs Pb
    Pb-containing vs Pb-free
    Relative resistance of solder, Cu, Ni, and IMC
    Effect of solder volume
    Relative performance of solder joints with variation in metallurgy and configuration
    Recommended designs of solder joints for superior EM resistance
  • EM resistance of RDL
    Effect of via diam, pad opening, Cu thickness of UBM, size of taper trace, configuration of RDL vs via location and solder location

Who Should Take This Course:
Any one who wants to know the electromigration phenomenon in details and wants to know how to prevent electromitration within their products should take this course.

About The Instructor:
Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 20 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973.

 

Pictures from the Event

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Badminton Tournament May 26, 2012

Pictures from the Event

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International Chapter of the Year

Our SMTA Penang Chapter was honored with recognition as an SMTA International Chapter of the Year at SMTA International in San Diego, California, USA recently.

Accepting the award on our behalf at the ceremony was Mr. Bill Barthel.

Technical Talk 24 February, 2011

Persatuan Surface Mount Technology P. Pinang presents:

"Deadly Mistakes" of SMT and Lead-Free Assembly

W. James Hall, ITM Consulting

Date: Thursday, February 24, 2011
Time: 6:30 pm
Location: SUNTECH Bayan Baru

This seminar will focus on the "10 Deadly Mistakes" of SMT - and there are actually more than just 10 - and they can make your assembly process a nightmare.

During the course of assembly process audits and troubleshooting work, we tend to see trends in the types of errors and problems. In other words, a lot of people are making the same mistakes. The resulting process problems wreak havoc with an impact on assembly yields ranging from 5 to 20%. In addition to this direct cost, there is also additional financial impact with regard to time spent reworking and repairing, the on corrective action by QC, Engineering and Management, and, of course, "do-over".

This lecture identifies the "deadly mistakes" of SMT assembly, both for Pb-free and "leaded" processes. Besides the symptoms and consequences of each type of error, root-cause, rectification and prevention techniques will be presented. The lecture will, thus, provide the participant with an understanding of how to identify and correct the most common SMT assembly problems. It will include identification of vendor and source problems including components and materials as well as design related problems.

 

Topics Covered

  • Utilization of process feedback data
  • Design for manufacturability and assembly
  • In-process inspection and AOI
  • Solder paste selection
  • MSD
  • Procedures and documentation
  • Stencil printing
  • Component placement and feeders
  • Reflow and wave soldering challenges
  • Inefficiency: unbalanced lines and excessive downtimes
  • Lead-Free Specific Process "Sins"
  • Uncontrolled mixed assembly
  • Stencil design, inspection and wave soldering

 

Speaker Background

Jim Hall is a Principal Consultant and resident Lean Six Sigma Master Black Belt with ITM Consulting (Durham, NH). His area of responsibility includes working with OEM's, Contract Assemblers, and Equipment Manufacturers to solve design and assembly problems, optimize facility operations, as well as teaching basic and new technologies in private and public forums throughout the industry, world-wide.

Jim is one of the authors of the highly acclaimed SMTA Process Certification Course, along with Dr. Ron Lasky and Phil Zarrow. From its introduction in September 2002, he has served as the program’s principal instructor, certifying over 200 engineers in the US, Canada, Mexico, Hong Kong, and China. Mr. Hall coordinates and implements all updates and improvements to the exams and course materials.

As ITM's resident Lean Six Sigma Master Black Belt, Jim is a strong proponent of in-process data capture and analysis for all assembly and related operations and other continuous improvement techniques. He participates as an instructor in the Lean - Six Sigma programs offered at Dartmouth College.

Mr. Hall, one of the pioneers of reflow technology, has been actively involved in electronic assembly technology for over 26 years. Jim's expertise lies in process development and integration, fluid and thermodynamics, and computer control systems. He has delivered numerous papers and workshops on surface mount technology at technical seminars around the world including those for NEPCON, IMAPS and SMTA. Jim is also the co-host of Circuitnet/Circuitmart's "BoardTalk" audio program.

Please reserve your spot without delay. We look forward to seeing you there!

SMTA Conference

South East Asia Technical Conference on Electronics Assembly Technologies

Date: May 19 and 20, 2011

Eastin Hotel

Penang, Malaysia

The SE Asia Technical Conference on Electronics Assembly Technology is sponsored by the SMTA with support from the Persatuan Surface Mount Technology P. Pinang.

The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. Sessions and topics in our 2011 program will focus on new processes and materials, reliability, cleaning challenges, harsh environment applications, advanced packaging to include package on package, process control and the latest developments in surface finishes. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.

Special recognition is given to the Technical Committee for their many contributions in developing this outstanding program.

Technical Committee

LyGuat Lee, Ph.D, Flextronics, Conference Chair
KL Lim, Plexus
Lian-Huat Ng, Plexus Corp.
Teng Hoon Ng, Celestica, Inc.
Jona Sjoberg, Flextronics
AK Tan, Robert Bosch Sdn Bhd
David Vetharudge, Listech Technology

 

Sessions Topics

  • Assembly - Process and Materials
  • Assembly - Reliability
  • Business
  • Cleaning for Today's Challenging Designs
  • Harsh Environment Applications
  • Advanced Packaging Assembly Developments
  • Process Control
  • Latest Developments in Surface Finish

View the full conference schedule

 

Accommodations

Eastin Hotel Penang
1 Solok Bayan Indah
Queens Bay, 11900 Bayan Lepas, Pulau Pinang, Malaysia
Tel: +604-6121111

 

Registration

Your registration fee will include a CD Conference Proceedings, coffee breaks, and lunches.

Title Members Non-members
Two-Day Conference RM455
US 150
RM607
US 200
One Day (Thursday) Conference RM303
US 100
RM379
US 125
One Day (Friday) Conference RM303
US 100
RM379
US 125
Speaker-Two-Day Conference (only select this if you are presenting at the event) RM306
US 100
RM306
US 100

Exhibition (Table Top)

Date: October 28, 2011

Venue: Eastin Hotel, Penang, Malaysia
1, Solok Bayan Indah, Queensbay,
11900 Bayan Lepas, Penang, Malaysia.

Exhibition Hours: 08:30 – 17:30

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronics assembly technologies, including microsystems, emerging technologies, and related business operations.

As Penang has the presence of many world’s key electronics multinational corporations and local companies, with large pools of professionals, it is beneficial to have an association that pursues professional development. The chapter is a non- profit organization.

The SMTA Penang Chapter is pleased to announce its 4th Vendor Show which will be held on October 28, 2011 at Eastin Hotel, Penang, Malaysia. The tabletop exhibition is especially popular among our industry suppliers, as this one-day event is designed to showcase products of the industry to users of SMT materials and services.

In conjunction to this 4th Vendor Show, a free technical seminar will be given that relates to surface mount technology and future trends in electronics assembly.

This show is an excellent opportunity to create and build brand awareness, increase your exposure, promote latest products and services, share your knowledge on latest technology to the local electronics and manufacturing industry professionals.

Visitors want to learn about what’s new in the industry, and make new contacts. Thus, this is an important way for exhibitors to hype up your presence in the industry and create top-of-mind awareness, besides selling your products and services.

We cordially invite you to participate in this Tabletop Exhibition cum Technical Seminar on Electronics Assembly Technologies. Please fill in the form below to register online. The Exhibit Space Application is coming soon.

Past Events

SMTAI Conference and Exhibition

Date: October 24 - 28, 2010

Venue: Orlando, Florida

For full information
visit www.smta.org/smtai.

Discover the
difference of a totally focused event.

A world-class conference and exhibition organized by the SMTA. A recent survey found that the most important reason that an attendee comes to a trade show is for the technical program and the SMTA will not disappoint you! Learn from the very best in our industry!

  • 20 tutorials, including a FREE half day course!
  • Over 130 technical papers from global experts
  • Special symposiums focused on Evolving Technologies, AIMS/Harsh Environments, Contract Manufacturing and Lead-Free Soldering Technology
  • Attendees from around the world!

Covering Today's Hot Topics:

  • Lead-Free (including military and space)
  • Printed Electronics
  • Reliability
  • 3D/Package on Package
  • BGAs and BTCs
  • Head in Pillow Defect
  • QFN and LGA Challenges
  • Counterfeit Electronics
  • Solar

For full information visit www.smta.org/smtai.

Friendly Badminton Match for SMTA Members

2010 Badminton Tournament

Trophies

This year, the Battle of the Champions was held at Bukit Dumbar Badminton Hall on Saturday, 14th of August. The badminton tournament received an overwhelming response. In fact, we did not anticipate the turnout of participants to be so great until we had to "disappoint" some people. Not to mention committee members had been kept in reserve.

A total of 32 players or 16 teams divided into 4 groups were drawn to compete for the champion. To avoid one-sided match, each player's partner was pre-drawn by the committee members. Despite of that, all participants had displayed friendly and pleasant games amongst themselves. After competing for almost 4 hours, a new Champion is born: CK Ang & CC Poh. The overall result is as below:

CHAMPIONS : CK ANG (Celestica) & CC POH (Chiptronics)
1ST RUNNER UP : HP KOH (Plexus) & CH LEE (Intel)
2ND RUNNER UP : HC TAN (Plexus) & CY FOO (DCI)
3RD RUNNER UP : VINCENT WONG (B’worth Electrical Sdn Bhd) & CL YEAP (Plexus)

SMTA Penang Chapter would like to take the opportunity to extend a heartfelt thank you to Dato Pang for his kind and generous sponsorship again. Dato Pang's support is not something we take likely and is very much appreciated by everyone connected to the chapter.

Overall, the entire weekend was a huge success, many great games were played, and a lot of fun was had by all.

Thanks again to everyone involved and we certainly look forward to holding it again next year.

SMTA Free Technical Talk

Date: 12 March 2010
Venue: Suntech City
Time: 2.00pm – 5.00pm
Fee: SMTA Members FREE,
Non Members: RM50.00

Presenters:

Title: Reworking CSP, Flip Chip & MSMD (Micro Surface Mount Devices)
Speaker: Mr. Ray LaFleur (Asia Support Mgr)
Company: VJ Electronics

Title: Vision Inspection
Speaker: Mr. Steve Marsh
Company: Vision Engineering

South East Asia Technical Conference

South East Asia Technical Conference on Electronics Assembly Technologies

December 15, 2009

Date: November 19-20, 2009

Venue: Equatorial Hotel
Penang, Malaysia

Penang, Malaysia - SMTA South East Asia announced today that the South East Asia Technical Conference on Electronics Assembly Technologies, held November 19-20, 2009, was a success.

“The technical conference was one of the best technical programs in our industry with excellent papers," said a session attendee. Twenty-three international experts on electronics assembly provided cutting-edge technical information to the conference attendees, covering topics ranging from assembly, components, emerging technologies, harsh environment applications, and PCB technology.

The Event was officiated by the Chief Minister of Penang, YAB Lim Guan Eng.

“The SMTA sends sincere thanks to everyone who exhibited this year,” said David Vetharudge, the Chairman of SMTA Penang Chapter. “Without the exhibits, a conference of this magnitude could not be accomplished.” David also took the liberty to thank Dato Pang Yun Thiam of Chiptronics on behalf of the Penang Chapter, Dato Pang was also given a supporter award for his valuable contribution towards the Penang Chapter at the event.

The Penang Chapter was honored to win the SMTA International Chapter of the Year award, which the chapter graciously accepted from Ms. JoAnn Stromberg, Executive Administrator of SMTA Headquarters.

For more information on SMTA events past, present or future please contact Penang SMTA Executive Coordinator David Vetharudge: dvetharudge@gmail.com or 604-630-3004.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Penang Chapter Technical Seminar April 3, 2009

Photos from the Penang Chapter Electronics Manufacturing Technology Conference.



Become A Member

For personal registration service:


Andelyn Teo
Email: admin@smtapenang.com.my
Phone: 604-643-3817

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